Electronic Assembly Products
A brief overview of some of our most popular pastes available in a wide array of package types.
- 406L-3 Series: Anti-Voiding / Anti-Pillowing / 72 hr Tac Time
- M500 Series: Anti-Voiding / Anti-Pillowing / Halogen Free / Powerful wetting
- M500C Series: Designed for heavily oxidized components.
- A230 Series: A TRUE no-clean paste that is much easier to clean. Reduces wash times by up to 75%.
- TB48-M742: Low melting point / Halogen Free / Cuts electricity & CO2 Emissions.
- 956-2: Anti-voiding / Anti-Pillowing / 72 hr Tac time.
- Flux is available from all paste families. There is a huge benefit in using this method to reduce waste but also to keep the reworked site clean since it does not flow like liquid flux.
- JM-20: A beautiful wire for hand soldering with less flux splatter.
- JU-110: New chipbonder that does not require dangerous goods transport saving enormous amounts of money.
- JU-100-5: Cures at 130C in 60 sec. Great for low or high speed printing.
- JU-41P/JU-44P: Cures at 130C in 60 sec. For printing applications.
- JU-R2S: Self aligning SMT adhesive for lead free double sided assemblies.
- JU-90LT: Low temperature curing chipbonder. 90-100C for 100 sec.
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